Bessel Ultra-fast Cutting Head Series

Commonly used in OLED panel cutting, full-screen mobile phone cover glass cutting, precision processing of intelligent wearable device protective glass, sapphire tapper-free cutting, wafer cutting, LCD panel cutting, and other fields.

Product details:

See below for the product advantages and a range of customisable variables: 

Advantage Highlight:

  • Imported quartz microscope.
  • The focusing spot is finer and more uniform
  • The chipping edge < 5um under 1000X

Different materials can be chosen, total transmission is >99.8%, and support 200W-50000W working environment.

Serial Number Design Wavelegth (nm) Depth of Focus (mm) Working Distance
(mm)
Entrance Beam Diameter
(μm)
HY-BSL-0.5-9-1064 1064 0.5 9 1.5
HY-BSL-1-9.5-1064 1064 1 9.5 2
HY-BSL-3-12-1064 1064 3 12 3.5
HY-BSL-6-17-1064 1064 6 17 4
HY-BSL-8-16-1064 1064 8 16 4
HY-BSL-8-16-1064 1064 8 16 4
HY-BSL-10-17-1064 1064 10 17 4
HY-BSL-0.5-9-532 532 0.5 9 0.7
HY-BSL-1-9-532 532 1 9 1
HY-BSL-3-9-532 532 3 9 1.7
HY-BSL-0.5-9-355 355 0.5 9 0.5
HY-BSL-1-9-355 355 1 9 0.7
HY-BSL-3-9-355 355 3 9 1.2

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In addition to our current portfolio and custom optical solutions, we offer a selection of high-performance lenses from our previous product range, available upon request. This includes lenses designed for various markets, applications, and technical specifications.
MORE wavelength options.
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MORE depth of working distance options.a